bonding: fix multiple module load problem
Some users still load bond module multiple times to create bonding
devices. This accidentally was broken by a later patch about
the time sysfs was fixed. According to Jay, it was broken
by:
commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
Author: Jay Vosburgh <fubar@us.ibm.com>
Date: Fri Jun 13 18:12:04 2008 -0700
bonding: Allow setting max_bonds to zero
Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.
Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
diff --git a/drivers/net/bonding/bond_sysfs.c b/drivers/net/bonding/bond_sysfs.c
index 3a1b7b0..5fb861a 100644
--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1541,6 +1541,7 @@
printk(KERN_ERR
"network device named %s already exists in sysfs",
class_attr_bonding_masters.attr.name);
+ ret = 0;
}
return ret;