bonding: ust micro BOND_NO_USE_ARP to simplify the mode check

The bond 3ad and TLB/ALB has the same check path, so combine them.

Signed-off-by: Ding Tianhong <dingtianhong@huawei.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
1 file changed