ARM: dts: Add CPU cooling binding for exynos3250 boards
This patch add the cooling device to control the overheating issue on
Exynos3250-based Rinato/Monk board.
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Acked-by Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
diff --git a/arch/arm/boot/dts/exynos3250-rinato.dts b/arch/arm/boot/dts/exynos3250-rinato.dts
index ddd7ac2..0e62a64 100644
--- a/arch/arm/boot/dts/exynos3250-rinato.dts
+++ b/arch/arm/boot/dts/exynos3250-rinato.dts
@@ -107,6 +107,21 @@
min-microvolt = <1100000>;
max-microvolt = <2700000>;
};
+
+ thermal-zones {
+ cpu_thermal: cpu-thermal {
+ cooling-maps {
+ map0 {
+ /* Corresponds to 500MHz */
+ cooling-device = <&cpu0 5 5>;
+ };
+ map1 {
+ /* Corresponds to 200MHz */
+ cooling-device = <&cpu0 8 8>;
+ };
+ };
+ };
+ };
};
&adc {