dt-bindings: add hym8563 binding
Add binding documentation for the hym8563 rtc chip.
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Richard Weinberger <richard.weinberger@gmail.com>
Cc: Mark Brown <broonie@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
index f29cd78..0977b15 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.txt
+++ b/Documentation/devicetree/bindings/vendor-prefixes.txt
@@ -34,6 +34,7 @@
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gmt Global Mixed-mode Technology, Inc.
+haoyu Haoyu Microelectronic Co. Ltd.
hisilicon Hisilicon Limited.
hp Hewlett Packard
ibm International Business Machines (IBM)