Merge tag 'iio-for-3.19a' of git://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio into staging-next
Jonathan writes:
First round of new drivers, features and cleanups for IIO in the 3.19 cycle.
New drivers / supported parts
* rockchip - rk3066-tsadc variant
* si7020 humidity and temperature sensor
* mcp320x - add mcp3001, mcp3002, mcp3004, mcp3008, mcp3201, mcp3202
* bmp280 pressure and temperature sensor
* Qualcomm SPMI PMIC current ADC driver
* Exynos_adc - support exynos7
New features
* vf610-adc - add temperature sensor support
* Documentation of current attributes, scaled pressure, offset and
scaled humidity, RGBC intensity gain factor and scale applied to
differential voltage channels.
* Bring iio_event_monitor up to date with newer modifiers.
* Add of_xlate function to allow for complex channel mappings from the
device tree.
* Add -g parameter to generic_buffer example to allow for devices with
directly fed (no trigger) buffers.
* Move exynos driver over to syscon for PMU register access.
Cleanups, fixes for new drivers
* lis3l02dq drop an unneeded else.
* st sensors - renam st_sensors to st_sensor_settings (for clarity)
* st sensors - drop an unused parameter from all the probe utility
functions.
* vf610 better error handling and tidy up.
* si7020 - cleanups following merge
* as3935 - drop some unnecessary semicolons.
* bmp280 - fix the pressure calculation.