| commit | d28a9689c93195d39f91f35a9519876688605b65 | [log] [tgz] |
|---|---|---|
| author | Anton Tikhomirov <av.tikhomirov@samsung.com> | Wed Feb 15 17:04:56 2012 +0900 |
| committer | Felipe Balbi <balbi@ti.com> | Fri Mar 02 12:11:28 2012 +0200 |
| tree | 39d7c0b3f80657039cefc3996c20010bdbabbed0 | |
| parent | f6bafc6a1c9d58f0c234ac5052b9c09b0747348c [diff] |
usb: dwc3: Add Exynos Specific Glue layer Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>